Man-Lung Sham: search on Z-Library

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1

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Sham, Man-Lung, Kim, Jang-Kyo

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 348 KB

english, 2005

2

Impact and delamination failure of woven-fabric composites

Jang-Kyo Kim, Man-Lung Sham

Journal:

Composites Science and Technology

Year:

2000

Language:

english

File:

PDF, 2.01 MB

english, 2000

3

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Advanced Packaging Technologies for Automotive Electronics

Sham, Man-Lung, Gao, Ziyang, Leung, Lydia Lap-Wai, Chen, Yu-Chih, Chung, Tom

Year:

2007

Language:

english

File:

PDF, 1.86 MB

english, 2007

4

Adhesion characteristics of underfill resins with flip chip package components

Sham, Man-Lung, Kim, Jang-Kyo

Journal:

Journal of Adhesion Science and Technology

Year:

2003

Language:

english

File:

PDF, 1.09 MB

english, 2003

5

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - FMEA of System-in-Package (SiP) -based Tire Pressure Monitoring System

Sham, Man-Lung, Lui, Tung-Chin, Gao, Ziyang, Chung, Tom

Year:

2008

Language:

english

File:

PDF, 561 KB

english, 2008

6

[IEEE First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. - Potsdam, Germany (21-24 Oct. 2001)] First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) - Measurement of residual stresses in flip chip underfill resins

Man-Lung Sham,, Jang-Kyo Kim,

Year:

2001

Language:

english

File:

PDF, 529 KB

english, 2001

7

Moisture barrier characteristics of organoclay–epoxy nanocomposites

Jang-Kyo Kim, Chugang Hu, Ricky S.C. Woo, Man-Lung Sham

Journal:

Composites Science and Technology

Year:

2005

Language:

english

File:

PDF, 344 KB

english, 2005

8

[IEEE 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Hong Kong, China & Shenzhen, China (5-6 Jan. 2004 & 7-9 Jan. 2004)] Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Effects of underfill adhesion on flip chip package reliability

Man-Lung Sham,, Jang-Kyo Kim,, Lee, R.S.W., Jingshen Wu,, Yuen, M.M.F.

Year:

2004

Language:

english

File:

PDF, 488 KB

english, 2004

9

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - High frequency thermosonic flip chip bonding for gold to gold interconnection

Pang, C.C.-H., Kin-Yik Hung,, Man-Lung Sham,

Year:

2004

Language:

english

File:

PDF, 351 KB

english, 2004

10

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Viscoelastic properties of underfill for numerical analysis of flip chip packages

Man-Lung Sham,, Jang-Kyo Kim,, Joo-Hyak Park,

Year:

2003

Language:

english

File:

PDF, 530 KB

english, 2003

11

Effect of hybrid layers with different silane coupling agents on impact response of glass fabric reinforced vinylester matrix composites

Jang-Kyo Kim, Man-Lung Sham, Min-Seok Sohn, Hiroyuki Hamada

Journal:

Year:

2001

Language:

english

File:

PDF, 175 KB

english, 2001

12

Effects of Fibre Surface Treatment on Dynamic Tensile Properties of Glass Woven Fabric Reinforced Vinylester Composites

Kim, Jang-Kyo, Sham, Man-Lung, Sohn, Min-Seok, Hu, Shisheng

Journal:

Polymers and Polymer Composites

Year:

2005

File:

PDF, 302 KB

2005

13

Nanoscale characterisation of interphase in silane treated glass fibre composites

Jang-Kyo Kim, Man-Lung Sham, Jingshen Wu

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

2001

Language:

english

File:

PDF, 511 KB

english, 2001

14

Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin

Man-Lung Sham, Jang-Kyo Kim, Joo-Hyuk Park

Journal:

Computational Materials Science

Year:

2007

Language:

english

File:

PDF, 1.61 MB

english, 2007

15

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatments

Man-Lung Sham,, Mei Lam,, Jang-Kyo Kim,

Year:

2001

Language:

english

File:

PDF, 724 KB

english, 2001

16

Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages

Man-Lung Sham, Jang-Kyo Kim

Journal:

Journal of Applied Polymer Science

Year:

2005

Language:

english

File:

PDF, 159 KB

english, 2005

17

Tensile strength of glass fibres with carbon nanotube–epoxy nanocomposite coating

Naveed A. Siddiqui, Man-Lung Sham, Ben Zhong Tang, Arshad Munir, Jang-Kyo Kim

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

2009

Language:

english

File:

PDF, 1021 KB

english, 2009

18

Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Man-Lung Sham, Jang-Kyo Kim

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

2004

Language:

english

File:

PDF, 373 KB

english, 2004

19

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Effects of flux residue and thermomechanical stresses on delamination failure in flip chip packages

Man-Lung Sham,, Jang-Kyo Kim,

Year:

2000

Language:

english

File:

PDF, 718 KB

english, 2000

20

Surface functionalities of multi-wall carbon nanotubes after UV/Ozone and TETA treatments

Man-Lung Sham, Jang-Kyo Kim

Journal:

Year:

2006

Language:

english

File:

PDF, 616 KB

english, 2006

21

Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

Man-Lung Sham, Jang-Kyo Kim, Joo-Hyuk Park

Journal:

Computational Materials Science

Year:

2008

Language:

english

File:

PDF, 3.58 MB

english, 2008

22

Tensile strength of glass fibres with carbon nanotube–epoxy nanocomposite coating: Effects of CNT morphology and dispersion state

Naveed A. Siddiqui, Erin L. Li, Man-Lung Sham, Ben Zhong Tang, Shang Lin Gao, Edith Mäder, Jang-Kyo Kim

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

2010

Language:

english

File:

PDF, 1.32 MB

english, 2010

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